Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packaging-Reference-Cited by-同舟云学术

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Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packaging

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Lianto Prayudi,Tan Chin Wei,Jie Peng Qi,Jumat Abdul Hakim,Dai Xundong,Peter Fung Khai Mum,Huei See Guan,Chong Ser Choong,Wee David Ho Soon,Serine Soh Siew Boon,Huang Sharon Lim Seow,Calvin Chua Hung Ming,Abdillah Haron Ahmad,Kenneth Lee Huan Ching,Zhang Mingsheng,Ko Zhi Hao,Ko San Ye,Leong Henry

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159233.pdf?arnumber=9159233

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development of New Concept Photo Imageable Dielectric Materials for Next-Generation Advanced Packaging;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Unraveling metallic contaminants in complex polyimide heterostructures using deep ultraviolet spectroscopic ellipsometry;Applied Physics Letters;2023-09-25

3. Development of high performance 2.5D packaging using glass interposer with through glass vias;Journal of Materials Science: Materials in Electronics;2023-09

4. Scaling of redistribution layer for Heterogeneous packaging in a panel level;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023

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