Analysis of the Influence of Bond Wire Aging on Junction Temperature Estimation in IGBT Modules
Author:
Affiliation:
1. Ministry of Education, Beijing Jiaotong University,Key Lab. of Vehicular Multi-Energy Drive Systems (VMEDS),Beijing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10582916/10582978/10583390.pdf?arnumber=10583390
Reference10 articles.
1. An Industry-Based Survey of Reliability in Power Electronic Converters
2. Improved Reliability of Power Modules: A Review of Online Junction Temperature Measurement Methods
3. In-Situ Calibration Method of Online Junction Temperature Estimation in IGBTs for Electric Vehicle Drives
4. Analytical and Experimental Investigation on A Dynamic Thermo-Sensitive Electrical Parameter With Maximum $dI_{C}/dt$ During Turn-off for High Power Trench Gate/Field-Stop IGBT Modules
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