Conceptual Design of a 20 T Hybrid Cos-Theta Dipole Superconducting Magnet for Future High-Energy Particle Accelerators
Author:
Affiliation:
1. Fermi National Accelerator Laboratory, Batavia, IL, USA
2. Lawrence Berkeley National Lab, Berkeley, CA, USA
Funder
U.S. Department of Energy
Office of Science
High Energy Physics
US Magnet Development Program
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
https://ieeexplore.ieee.org/ielam/77/10025583/10057098-aam.pdf
Reference15 articles.
1. Development of MQXF: The Nb3Sn Low- $\beta$ Quadrupole for the HiLumi LHC
2. The use of pressurized bladders for stress control of superconducting magnets
3. Development of a 120-mm Aperture Nb3Sn Dipole Coil With Stress Management
4. Towards 20 T Hybrid Accelerator Dipole Magnets
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Subscale Stress-Managed Common Coil Design;IEEE Transactions on Applied Superconductivity;2024-08
2. Estimated electric conductivities of thermal plasma for air-fuel combustion and oxy-fuel combustion with potassium or cesium seeding;Heliyon;2024-06
3. Investigation of Pinning and Current-Carrying Capacity in 2G HTS Wires With Artificial Pinning Centers Obtained at Various Deposition Rates;IEEE Transactions on Applied Superconductivity;2023-12
4. Conceptual Design of 20 T Hybrid Accelerator Dipole Magnets;IEEE Transactions on Applied Superconductivity;2023-08
5. 20 T Hybrid Nb3Sn-HTS Block-Coil Accelerator Dipole With Stress-Management;IEEE Transactions on Applied Superconductivity;2023-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3