A High Performance Insulated REBCO Pancake With Conductive Cooling Capability-Reference-Cited by-同舟云学术

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A High Performance Insulated REBCO Pancake With Conductive Cooling Capability

Published:2023-08 Issue:5 Volume:33 Page:1-5
ISSN:1051-8223
Container-title:IEEE Transactions on Applied Superconductivity
language:
Short-container-title:IEEE Trans. Appl. Supercond.

Author:

Vialle Julien¹^ORCID,Badel Arnaud¹^ORCID,Takahashi Kohki²^ORCID,Awaji Satoshi²^ORCID,Tixador Pascal¹

Affiliation:

1. CNRS, G2Elab, University Grenoble Alpes, Grenoble, France

2. HLFSM, Tohoku University, Sendai, Japan

Funder

Japanese and French Collaboration

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/77/10025583/10040533.pdf?arnumber=10040533

Reference16 articles.

1. Mechanical Properties of Four-Stacked Two Tape Bundled REBCO Pancake Coils

2. Test in Strong Background Field of a Modular Element of a REBCO 1 MJ High Energy Density SMES

3. Evaluation of Actual Delamination Strength of REBCO-Coated Conductors Based on the Weibull Analysis Considering Size Effect

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Numerical modelling of electromechanical coupling behaviors in HTS coil with implementation of H formulation in FE software;Superconductivity;2024-06

2. First Validation of Robust REBCO Insert Concept on a Large 20-Pancake Prototype Reaching Up to 25 T;IEEE Transactions on Applied Superconductivity;2023-08

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