Author:
Patterson D.,Anderson T.,Cardwell N.,Fromm R.,Keeton K.,Kozyrakis C.,Thomas R.,Yelick K.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Cited by
354 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. AIO: An Abstraction for Performance Analysis Across Diverse Accelerator Architectures;2024 ACM/IEEE 51st Annual International Symposium on Computer Architecture (ISCA);2024-06-29
2. PID-Comm: A Fast and Flexible Collective Communication Framework for Commodity Processing-in-DIMM Devices;2024 ACM/IEEE 51st Annual International Symposium on Computer Architecture (ISCA);2024-06-29
3. Simultaneous Many-Row Activation in Off-the-Shelf DRAM Chips: Experimental Characterization and Analysis;2024 54th Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN);2024-06-24
4. PIM-DL: Expanding the Applicability of Commodity DRAM-PIMs for Deep Learning via Algorithm-System Co-Optimization;Proceedings of the 29th ACM International Conference on Architectural Support for Programming Languages and Operating Systems, Volume 2;2024-04-27
5. Testability Considerations for Custom Processing-In-Memory Cores;2024 12th International Electrical Engineering Congress (iEECON);2024-03-06