Design and Analysis of Weather Parameters Using MEMS Technology with Suitable Characteristics for Integration into a Single Chip for Environment Monitoring-Reference-Cited by-同舟云学术

Design and Analysis of Weather Parameters Using MEMS Technology with Suitable Characteristics for Integration into a Single Chip for Environment Monitoring

Published:2024-07-18 Issue: Volume: Page:1-7
ISSN:
Container-title:2024 Third International Conference on Smart Technologies and Systems for Next Generation Computing (ICSTSN)
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Author:

Hassan Abdurrashid S.¹,Juliet Vimala A.¹,Agbulu G. Pius²,Kumar G. Joselin Retna³,N V Raghavendra Reddy⁴,Gunasekar S⁵

Affiliation:

1. SRM Institute of Science and Technology,Department of Electronics and Control/Instrumentation Engineering,Chennai,Tamil Nadu,India

2. Chinhoyi University of Technology,School of Engineering Sciences & Technology,Department of Mechatronic Engineering,Chinhoyi,Zimbabwe

3. SRM Institute of Science and Technology,Department of Electronics and Instrumentation Engineering,Chennai,Tamil Nadu,India

4. RV Institute of Technology and Management,Department of Mechanical Engineering,Karnataka,India

5. Rajalakshmi Engineering College,Department of Computer Science and Engineering,Chennai,India

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10670699/10670715/10671375.pdf?arnumber=10671375

Reference22 articles.

1. Low-cost, multimodal environmental monitoring based on the Internet of Things

2. Current Status and Application of Micro-electromechanical Systems (MEMS)

3. CMOS-MEMS Technologies for the Applications of Environment Sensors and Environment Sensing Hubs

4. Design, development and testing of digital MEMS pressure sensor array for full-scale vibroacoustic measurements

5. Measuring Air Speed With a Low-Power MEMS Ultrasonic Anemometer via Adaptive Phase Tracking