Interpreting accelerated test results for lead free solder joints-Reference-Cited by-同舟云学术

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Interpreting accelerated test results for lead free solder joints

Published:2016-01 Issue: Volume: Page:
ISSN:
Container-title:2016 Pan Pacific Microelectronics Symposium (Pan Pacific)
language:
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Author:

Borgesen P.,Hamasha S.,Wentlent L.,Watson D.,Greene C.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7422513/7428382/7428390.pdf?arnumber=7428390

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03

2. Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions;Materials;2023-01-12

3. Reliability modeling for aged SAC305 solder joints cycled in accelerated shear fatigue test;Microelectronics Reliability;2020-01

4. A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint;Journal of Electronic Packaging;2019-05-17

5. Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint;Journal of Electronic Packaging;2018-05-21

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