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A SiGe HBT 215-240 GHz DCA IQ TX/RX Chipset With Built-In Test of USB/LSB RF Asymmetry for 100+ Gb/s Data Rates

  • Published:2021 Issue: Volume: Page:1-1
  • ISSN:0018-9480
  • Container-title:IEEE Transactions on Microwave Theory and Techniques
  • language:
  • Short-container-title:IEEE Trans. Microwave Theory Techn.

Author:

Grzyb JanuszORCID,Rodriguez-Vazquez PedroORCID,Malz Stefan,Andree MarcelORCID,Pfeiffer Ullrich R.ORCID

Funder

German Research Council Deutsche Forschungsgemeinschaft DFG Priority Programme Schwerpunktprogramm SPP

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Cited by 22 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-05

2. A 185-to-240 GHz SiGe Power Amplifier Using Non-Zero Base-Impedances for Power Gain and Output Power Optimizations;IEEE Journal on Emerging and Selected Topics in Circuits and Systems;2024-03

3. Performance Evaluation of Ultra-Wideband 246-GHz BPSK Transmitters on an Organic Substrate With External Chip and Substrate Antenna;IEEE Transactions on Microwave Theory and Techniques;2024

4. A 135 GHz Direct-Digital 16-QAM Wireless and DWG Link;Analog Circuits and Signal Processing;2024

5. System-Level Considerations;Analog Circuits and Signal Processing;2024
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