Process optimization of Flatness of LTCC Substrate for TR Module

Author:

Li Shanze1,Yang Shicheng1,Xu Meijuan1,Wang Tingting1,Liu Xu1,Jia Xuzhou1

Affiliation:

1. China Academy of space technology,Science and Technology on Space Microwave,Xi’an,China

Publisher

IEEE

Reference9 articles.

1. Effect of sintering heating rate on properties of low temperature co-fired ceramic substrate;Hou;Bulletin of the chinese ceramic society,2022

2. Reliability analysis of lead-tin soldering of platinum palladium film on LTCC substrate;Xu;Electronic Process Technology,2021

3. LTCC materials and devices: industrial development and analysis;Yang;Electronic Components and Materials,2021

4. Heat transfer performance of microchannels in LTCC substrate, electrical and magnetic properties;Hu;High power laser and papticle beams,2016

5. Effects of sio2 addition on densification and co-fireable properties of LTCC substrates;Chen;Electronic Components and Materials,2020

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