Comparison of EMI Improved Differential Input Pair Structures Within an Integrated Folded Cascode Operational Transconductance Amplifier-Reference-Cited by-同舟云学术

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Comparison of EMI Improved Differential Input Pair Structures Within an Integrated Folded Cascode Operational Transconductance Amplifier

Published:2020-10-07 Issue: Volume: Page:
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Container-title:2020 Austrochip Workshop on Microelectronics (Austrochip)
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Author:

Zupan Dominik,Deutschmann Bernd

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9232924/9232970/09232994.pdf?arnumber=9232994

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Characterizing the Electromagnetic Immunity of Operational Amplifiers based on EMIRR and DPI;2023 International Symposium on Electromagnetic Compatibility – EMC Europe;2023-09-04

2. Comparison of Simulation and Measurement of EMI-Induced Offset Voltages Occuring at Folded Cascode Operational Amplifiers;2022 Austrochip Workshop on Microelectronics (Austrochip);2022-10-11

3. A SPICE Model of Operational Amplifiers for Electromagnetic Susceptibility Analysis;IEEE Transactions on Electromagnetic Compatibility;2022-04

4. Influence of Layout Parasitics on EMI Improved Folded Cascode Amplifier Input Stages Using Compensation Methods;2021 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo);2022-03-09

5. Noise Behaviour of EMI Improved Folded Cascode Amplifier Input Stages Including Layout Parasitics;2021 Austrochip Workshop on Microelectronics (Austrochip);2021-10-14

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