Effect of POSS on the Dielectric Properties of Thermally Aged Epoxy Resin Insulating Materials-Reference-Cited by-同舟云学术

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Effect of POSS on the Dielectric Properties of Thermally Aged Epoxy Resin Insulating Materials

Published:2022-10 Issue:5 Volume:29 Page:1763-1770
ISSN:1070-9878
Container-title:IEEE Transactions on Dielectrics and Electrical Insulation
language:
Short-container-title:IEEE Trans. Dielect. Electr. Insul.

Author:

Shi Yinjun¹^ORCID,Zhao Yushun¹^ORCID,Gong Chao¹,Xu Yufan¹^ORCID,Chen George²^ORCID,Du Bin¹^ORCID,Li Dengyun³

Affiliation:

1. Electrical Engineering Department, Hefei University of Technology, Hefei, Anhui, China

2. School of Electronics and Computer Science, University of Southampton, Southampton, U.K

3. China Electric Power Research Institute Company Ltd., Wuhan, Hubei, China

Funder

Science and Technology Project of SGCC

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/94/9903995/09841601.pdf?arnumber=9841601

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhanced high‐temperature electrical properties and charge dynamics of inorganic/organic silicone elastomer nanocomposites via nanostructure grafting and molecular trap construction;Polymer Composites;2024-05-16

2. Review on Thermal and Electrical Properties for Condition Assessment of Epoxy Nano- Composites by Advanced Techniques;IEEE Transactions on Dielectrics and Electrical Insulation;2024-02

3. An Experimental Investigation on Charge Trapping Characteristics of Epoxy Nanocomposites based on Quantum Chemical Analysis;2024 IEEE 3rd International Conference on Control, Instrumentation, Energy & Communication (CIEC);2024-01-25

4. Epoxy resin/POSS nanocomposites with low permittivity and excellent mechanical properties;Journal of Materials Science: Materials in Electronics;2023-12-22

5. High thermal conductivity insulating AlN/poly(m-phenylenedicarbonyl-m-phenylenediamine) paper realized by enhanced compatibility: a selection of appropriate coupling agent;Journal of Physics D: Applied Physics;2023-08-02

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