Thermal Diffusivity Measurement in Through-Thickness Direction of Dielectric Film With Metal Substrate
Author:
Affiliation:
1. Department of Electrical Engineering, Tongji University, Shanghai, China
Funder
Natural Science Foundation of Shanghai
National Natural Science Foundation of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/94/9737443/09697082.pdf?arnumber=9697082
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1. Fast thermal-pulse measurements of space-charge distributions in electret polymers
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