Temperature- and Degradation-Dependent Maximum Electric Field Stress in Wire-Bonding Power Modules Under PWM Waves-Reference-Cited by-同舟云学术

Temperature- and Degradation-Dependent Maximum Electric Field Stress in Wire-Bonding Power Modules Under PWM Waves

Published:2022-12 Issue:6 Volume:10 Page:7653-7664
ISSN:2168-6777
Container-title:IEEE Journal of Emerging and Selected Topics in Power Electronics
language:
Short-container-title:IEEE J. Emerg. Sel. Topics Power Electron.

Author:

Lin Ying¹^ORCID,Zhang Yunxiao²,Liu Yuhao³^ORCID,Wu Kangning⁴^ORCID,Li Helong¹^ORCID,Wang Jianing¹^ORCID,Li Kejie¹^ORCID,Ding Lijian¹^ORCID

Affiliation:

1. School of Electrical and Automation Engineering, Hefei University of Technology, Hefei, China

2. College of Electrical Engineering and Automation, Fuzhou University, Fuzhou, China

3. Laboratory of Advanced Technology of Electrical Engineering and Energy, Graduate School at Shenzhen, Tsinghua University, Shenzhen, China

4. State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China

Funder

Fundamental Research Funds for the Central Universities

Natural Science Foundation of Anhui Province

Institute of Energy, Hefei Comprehensive National Science Center

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Link

Reference42 articles.

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