Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges-Reference-Cited by-同舟云学术

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Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges

Published:2018-12 Issue: Volume: Page:
ISSN:
Container-title:2018 25th IEEE International Conference on Electronics, Circuits and Systems (ICECS)
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Author:

Vivet Pascal,Thuries Sebastien,Billoint Olivier,Choisnet Sylvain,Lattard Didier,Beigne Edith,Batude Perrine

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8599658/8617837/08617955.pdf?arnumber=8617955

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. TEFLON: Thermally Efficient Dataflow-aware 3D NoC for Accelerating CNN Inferencing on Manycore PIM Architectures;ACM Transactions on Embedded Computing Systems;2024-08-14

2. Research on thermal management of 3D-ICs assisted by deep learning;Microelectronics Reliability;2024-08

3. Investigations on Cylindrical Surrounding Double-gate (CSDG) Mosfet using AL_XGA_1-XAS/INP: PT with LA₂O₃Oxide Layer for Fabrication;Recent Patents on Nanotechnology;2024-06

4. Dataflow-Aware PIM-Enabled Manycore Architecture for Deep Learning Workloads;2024 Design, Automation & Test in Europe Conference & Exhibition (DATE);2024-03-25

5. More-than-moore steep slope devices for higher frequency switching applications: a designer’s perspective;Physica Scripta;2024-03-11

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