Author:
Agnesina Anthony,Brunion Moritz,Kim Jinwoo,Garcia-Ortiz Alberto,Milojevic Dragomir,Catthoor Francky,Perumkunnil Manu,Lim Sung Kyu
Cited by
4 articles.
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1. Cross-Die Optimization for Logic-on-Memory Face-to-Face Bonding 3-D IC Designs;2024 2nd International Symposium of Electronics Design Automation (ISEDA);2024-05-10
2. Multi-Product Optimization for 3D Heterogeneous Integration with D2W Bonding;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28
3. Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03
4. Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICs;ACM/IEEE International Symposium on Low Power Electronics and Design;2022-08