CAD-based net capacitance testing of unpopulated MCM substrates
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering
Link
http://xplorestaging.ieee.org/ielx4/96/7334/00296430.pdf?arnumber=296430
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. One-Port Resonance-Based Test Technique for RF Interconnect and Filters Embedded in RF Substrates;IEEE Transactions on Components, Packaging and Manufacturing Technology;2013-02
2. Low-Frequency and Low-Cost Test Methodology for Integrated RF Substrates;IEEE Transactions on Advanced Packaging;2010-08
3. FPGA Based System for Open, Short, and RC Impedance Measurement;IEEE Transactions on Advanced Packaging;2010-02
4. A survey of test techniques for MCM substrates;Journal of Electronic Testing;1997
5. A novel test technique for MCM substrates;IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B;1997
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