A Double-Sided Cooling 650V/30A GaN Power Module with Low Parasitic Inductance
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9121924/9123991/09124425.pdf?arnumber=9124425
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Design and Transient Analysis of a 650 V/150 A GaN Power Modules With Integrated Bias Power and Gate-Drive Circuit;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03
2. Structural, optical, and electrical characterization and performance comparison of AlGaN/GaN HEMT structures with different buffer layers;Vacuum;2024-01
3. Overview of Wide/Ultrawide Bandgap Power Semiconductor Devices for Distributed Energy Resources;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-08
4. Review of Double-Sided Cooling Power Modules for Driving Electric Vehicles;IEEE Transactions on Device and Materials Reliability;2023-06
5. Application-Oriented Characterization of Thermally Optimized, Asymmetrical Single Chip Packages for 100 V GaN HEMTs;2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD);2023-05-28
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