Failure prediction analysis of an ACCC conductor subjected to thermal and mechanical stresses-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Failure prediction analysis of an ACCC conductor subjected to thermal and mechanical stresses

Published:2010-04 Issue:2 Volume:17 Page:588-596
ISSN:1070-9878
Container-title:IEEE Transactions on Dielectrics and Electrical Insulation
language:
Short-container-title:IEEE Trans. Dielect. Electr. Insul.

Author:

Burks B.,Armentrout D.,Kumosa M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/94/5448081/05448116.pdf?arnumber=5448116

Cited by 34 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Novel Variable Impedance Design Concept of PM Fault Tolerant Machine;2023 26th International Conference on Electrical Machines and Systems (ICEMS);2023-11-05

2. A Novel Variable Impedance PM Machines with Separated Fault Tolerant Ring;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29

3. Research on Stress Delamination Characteristics of Aluminum Conductor Steel Reinforced Considering Radial Temperature Difference;2023 5th International Conference on Electronic Engineering and Informatics (EEI);2023-06-30

4. Analysis of Short-Circuit Current Automatic Suppression for Toroidal Winding PM Machines;IEEE Transactions on Power Electronics;2023

5. A Novel Variable Impedance PM Fault-Tolerant Machine for Ultrahigh-Reliability Applications;IEEE Transactions on Industrial Electronics;2023

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP