A Board Level Vibration Test Method for Electronic Industry Application-Reference-Cited by-同舟云学术

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A Board Level Vibration Test Method for Electronic Industry Application

Published:2023-12-05 Issue: Volume:5 Page:307-315
ISSN:
Container-title:2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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Author:

Xie Dongji¹,Lee Jeffrey²,Khaldarov Valeriy³,Zhang Andy⁴,I Xue S H⁵,X P Romuald RoucouN⁶,Doranga Sushil⁷,Kelly Brian⁸

Affiliation:

1. Nvidia Corporation,Santa Clara,CA,US

2. IST-Integrated Service Technology Inc.,Hsinchu,Taiwan

3. ASONIKA, LLC,Tempe,AZ,US

4. Texas Instruments,Dallas,TX,US

5. Bosch Automotive Products,Suzhou,P.R.China

6. Semiconductors,Nijmegen,The Netherlands

7. Lamar University,Beaumont,TX,US

8. AMD,Austin,TX,US

Funder

Advanced Micro Devices

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457684.pdf?arnumber=10457684

Reference13 articles.

1. Road Test and Reliability Analysis of Automotive Electronic Modules

2. Combined vibration and thermal cycling fatigue analysis for SAC305 lead free solder assemblies

3. Finite element based fatigue life prediction for electronic components under random vibration loading

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