Failure Mode Evaluation of QFP Package Interconnect Structure under Random Vibrations
Author:
Affiliation:
1. Yokohama National University,Department of Mechanical Engineering,Hodogaya-ku,Japan,240-5801
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457790.pdf?arnumber=10457790
Reference11 articles.
1. Failure and failure characterization of QFP package interconnect structure under random vibration condition
2. Combined vibration and thermal cycling fatigue analysis for SAC305 lead free solder assemblies
3. Effect of Grain Size on Fatigue Behavior of Pure Copper and Cu-Al Alloys
4. Study on Reliability Design Method of Solder joint on Chip Component (Crack Propagation Mode and Design Method of Solder joint)
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