Taking AI to the edge: Google's TPU now comes in a maker-friendly package-Reference-Cited by-同舟云学术

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Taking AI to the edge: Google's TPU now comes in a maker-friendly package

Published:2019-05 Issue:5 Volume:56 Page:16-17
ISSN:0018-9235
Container-title:IEEE Spectrum
language:
Short-container-title:IEEE Spectr.

Author:

Cass Stephen

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/6/8701135/08701189.pdf?arnumber=8701189

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