Capillary-activated scalable microporous copper microchannels for two-phase thermal management of semiconductor materials-Reference-Cited by-同舟云学术

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Capillary-activated scalable microporous copper microchannels for two-phase thermal management of semiconductor materials

Published:2023-05-30 Issue: Volume: Page:
ISSN:
Container-title:2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Dewanjee Sujan¹,Singhal Gaurav S.²,Li Jiaqi¹,Lohan Danny³,Joshi Shailesh N.¹,Braun Paul V.²,Miljkovic Nenad¹

Affiliation:

1. University of Illinois Urbana-Champaign,Department of Mechanical Science and Engineering,Urbana,IL,USA,61801

2. University of Illinois Urbana-Champaign,Department of Material Science and Engineering,Urbana,IL,USA,61801

3. Toyota Research Institute of North America,Electronics Research Department,Ann Arbor,Michigan,USA,48105

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10177286/10177494/10177496.pdf?arnumber=10177496

Reference19 articles.

1. Copper Foam Structures with Highly Porous Nanostructured Walls

2. Role of Wickability on the Critical Heat Flux of Structured Superhydrophilic Surfaces

3. Boiling crisis controlled by capillary pumping and viscous friction: Liquid penetration length and dry spot diameter

4. Critical height of micro/nano structures for pool boiling heat transfer enhancement

5. Critical heat flux maxima resulting from the controlled morphology of nanoporous hydrophilic surface layers

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