Process Recipes of Additively Printed Sustainable Silver-Ink Using Aerosol Jet Printing-Reference-Cited by-同舟云学术

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Process Recipes of Additively Printed Sustainable Silver-Ink Using Aerosol Jet Printing

Published:2023-05-30 Issue: Volume: Page:
ISSN:
Container-title:2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Lall Pradeep¹,Bimali Sabina¹,Soni Ved¹,Miller Scott²

Affiliation:

1. Auburn University,NSF-CAVE3 Electronics Research Center,Department of Mechanical Engineering,Auburn,AL,36849

2. NextFlex Manufacturing Institute,San Jose,CA,95131

Funder

Air Force Research Laboratory

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10177286/10177494/10177634.pdf?arnumber=10177634

Reference11 articles.

1. Process Development for Printing Copper Conductible Ink on Flexible Substrates using Aerosol Jet Printing Technology

2. Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

3. Aerosol Jet printing on rapid prototyping materials for fine pitch electronic applications

4. A review on the green and sustainable synthesis of silver nanoparticles and one-dimensional silver nanostructures

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparison of Sustainable and Non-Sustainable Ink Process-Performance Interactions for Additively Printed Circuits;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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