A Hybridizable Discontinuous Galerkin Time-Domain Method With Robin Transmission Condition for Transient Thermal Analysis of 3-D Integrated Circuits-Reference-Cited by-同舟云学术

A Hybridizable Discontinuous Galerkin Time-Domain Method With Robin Transmission Condition for Transient Thermal Analysis of 3-D Integrated Circuits

Published:2022-09 Issue:9 Volume:12 Page:1474-1483
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Zhang Xuan¹,Li Ping¹^ORCID,Li Xiao Chun¹,Jiang Li Jun²^ORCID,Mao Jun Fa¹^ORCID

Affiliation:

1. Key Laboratory of Ministry of Education of Design and Electromagnetic Compatibility of High-Speed Electronic Systems, Shanghai Jiao Tong University, Shanghai, China

2. Department of Electrical and Electronic Engineering, The University of Hong Kong, Pok Fu Lam, Hong Kong

Funder

National Key Research and Development Program of China

Shanghai Committee of Science and Technology

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9913798/09866035.pdf?arnumber=9866035

Reference30 articles.

1. Efficient Transient Thermal Simulation of ICs and Packages With Laguerre-Based Finite-Element Method

2. Electrical-Thermal Co-Simulation of 3D Integrated Systems With Micro-Fluidic Cooling and Joule Heating Effects

3. Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs

4. Transient electrical-thermal analysis of 3-D power distribution network with FETI-enabled parallel computing;lu;IEEE Trans Compon Packag Manuf Technol,2014

5. Electrical-Thermal Co-Simulation for Analysis of High-Power RF/Microwave Components

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