Funder
ANSYS
SK Hynix Inc.
Ministry of Science, ICT and Future Planning
Korea Research Council for Industrial Science and Technology
International Collaborative R&D Program through the Ministry of Trade, Industry and Energy, South Korea
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
27 articles.
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1. Design Methodology of Through-Silicon via for Crosstalk Optimization Based on Impedance;2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa);2024-05-20
2. Fast Prediction Method for Scattering Parameters of Rigid-Flex PCBs Based on ANN;Sensors;2024-03-30
3. High-frequency Transmission Characteristic Analysis of TSV-RDL Interconnects;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024
4. A New Wideband RLGC Extraction Method for Multiconductor Transmission Lines Using Improved Mode Tracking Algorithm;IEEE Transactions on Electromagnetic Compatibility;2024
5. Signal Integrity Measurement Issue Debugging for HDMI2.1 CRLS Topology: A Case Study;2023 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON);2023-12-11