Author:
Sharma Gaurav,Rao Vempati Srinivas,Kumar Aditya,Ying Lim Ying,Houe Khong Chee,Lim Sharon,Sekhar Vasarla Nagendra,Rajoo Ranjan,Kripesh Vaidyanathan,Lau John H.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Review of Mechanism and Technology of Hybrid Bonding;Journal of Electronic Packaging;2024-07-25
2. Fan-Out Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
3. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
4. Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV-Less Interposers;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-08
5. 2D, 2.1D, and 2.3D IC Integration;Semiconductor Advanced Packaging;2021