A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5-D/3-D Interposers-Reference-Cited by-同舟云学术

A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5-D/3-D Interposers

Published:2023-03 Issue:3 Volume:13 Page:291-299
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Liu Fuhan¹,Nimbalkar Pratik¹^ORCID,Aslani-Amoli Nahid¹^ORCID,Kathaperumal Mohanalingam¹^ORCID,Tummala Rao¹,Swaminathan Madhavan¹^ORCID

Affiliation:

1. 3-D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA

Funder

Industry Consortium of 3-D Systems Packaging Research Center.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference26 articles.

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