High-Temperature Failure Mechanism and Lifetime Assessment of Silicone Gel Package Insulation for High-Power Electronic Devices Based on Pyrolysis Kinetics-Reference-Cited by-同舟云学术

High-Temperature Failure Mechanism and Lifetime Assessment of Silicone Gel Package Insulation for High-Power Electronic Devices Based on Pyrolysis Kinetics

Published:2024-01 Issue:1 Volume:60 Page:1298-1309
ISSN:0093-9994
Container-title:IEEE Transactions on Industry Applications
language:
Short-container-title:IEEE Trans. on Ind. Applicat.

Author:

Wang Wei¹,Gong Yanfeng¹,Ren Hanwen¹^ORCID,Wang Jian¹^ORCID,Li Qingmin¹^ORCID

Affiliation:

1. Department of State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Beijing, China

Funder

National Key R&D Program of China

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Control and Systems Engineering

Link

http://xplorestaging.ieee.org/ielx7/28/10410107/10227575.pdf?arnumber=10227575

Reference32 articles.

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3. Impacts of coupled temperatureFrequency effects on partial discharge characteristics of high frequency solid state transformer insulation;Han;Trans. China Electrotechnical Soc.,2015

4. Reliability Enhancement of a Power Semiconductor With Optimized Solder Layer Thickness

5. An Industry-Based Survey of Reliability in Power Electronic Converters

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