Thermal Characterization of Mono and Multilayer Hexagonal Boron Nitride Heat Spreaders
Author:
Affiliation:
1. Universiti Teknologi Malaysia,Kuala Lumpur,Malaysia
2. MIMOS Semiconductor (M) Sdn Bhd,Kuala Lumpur,Malaysia
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9862946/9862950/09863131.pdf?arnumber=9863131
Reference10 articles.
1. APCVD hexagonal boron nitride thin films for passive near-junction thermal management of electronics;pratik;Nanotechnology,2017
2. Electrothermal analysis of CVD-grown hBN heat spreader using Pt/Cu/Ti micro-coil;nazim;J Electron Mater,2022
3. Influence of Polymeric Residue on the Thermal Conductivity of Suspended Bilayer Graphene
4. Thermal Characterization of Multi‐Layer Graphene Heat Spreader by Pt/Cu/Ti Micro‐Coil
5. Preserving thin layer of GO for direct growth of VG using a low-etch shielded PECVD
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