Multi-objective module placement for 3-D system-on-package-Reference-Cited by-同舟云学术

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Multi-objective module placement for 3-D system-on-package

Published:2006-05 Issue:5 Volume:14 Page:553-557
ISSN:1063-8210
Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
language:
Short-container-title:IEEE Trans. VLSI Syst.

Author:

Eric Wong ,Minz J.,Sung Kyu Lim

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx5/92/34605/01650233.pdf?arnumber=1650233

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Comprehensive Analysis in Recent Advances in 3D VLSI Floorplan Representations;Lecture Notes in Electrical Engineering;2022-12-01

2. Improvements of System-in-Package Integration and Electrical Performance Using BVA Wire Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2017-07

3. References;Three-Dimensional Integrated Circuit Design;2017

4. Thermal-aware P/G TSV planning for IR drop reduction in 3D ICs;Integration;2013-01

5. Three-dimensional Integrated Circuits: Design, EDA, and Architecture;Foundations and Trends® in Electronic Design Automation;2011

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