Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Cited by
10 articles.
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1. Electromigration-Aware Interconnect Design;Proceedings of the 2019 International Symposium on Physical Design;2019-04-04
2. Reliability Evaluation with Heat Dissipation Effect for a Ka-band MMIC PA;Proceedings of the 2nd International Conference on Telecommunications and Communication Engineering - ICTCE 2018;2018
3. Experimental Setup;Electromigration Inside Logic Cells;2016-11-30
4. Modeling Cell-Internal EM;Electromigration Inside Logic Cells;2016-11-30
5. State of the Art;Electromigration Inside Logic Cells;2016-11-30