Author:
Van Hauwermeiren L.,Botte M.,De Zutter D.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials
Cited by
7 articles.
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1. Comparative Evaluation of Multiline TRL and 2X-Thru De-Embedding Implementation Methods on Printed Circuit Board Measurements;2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD);2023-07-03
2. Impedance Corrected De-Embedding;IEEE Electromagnetic Compatibility Magazine;2022
3. Using a 2x‐thru standard to achieve accurate de‐embedding of measurements;Microwave and Optical Technology Letters;2019-10-29
4. A De-Embedding Technique of a Three-Port Network with Two Ports Coupled;Journal of electromagnetic engineering and science;2015-10-31
5. On the De-Embedding Issue of Millimeter-Wave and Sub-Millimeter-Wave Measurement and Circuit Design;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-08