Low Conductance State Drift Characterization and Mitigation in Resistive Switching Memories (RRAM) for Artificial Neural Networks

Author:

Baroni Andrea1ORCID,Glukhov Artem2ORCID,Perez Eduardo3ORCID,Wenger Christian4ORCID,Ielmini Daniele2ORCID,Olivo Piero5ORCID,Zambelli Cristian5ORCID

Affiliation:

1. Material Research Department, IHP—Leibniz Institut fur innovative Mikroelektronik, Frankfurt (Oder), Germany

2. Dipartimento di Elettronica, Informazione e Bioingegneria, Politecnico di Milano and IU.NET, Milano, Italy

3. Material Research Department, IHPŮLeibniz Institut fur innovative Mikroelektronik, Frankfurt (Oder), Germany

4. Material Research Department, IHP-Leibniz Institut fur innovative Mikroelektronik, Frankfurt (Oder), Germany

5. Dipartimento di Ingegneria, Universita degli Studi di Ferrara, Ferrara, Italy

Funder

ECSEL Joint Undertaking

European Union’s Horizon 2020 Research and Innovation Programme and France, Belgium, Czech Republic, Germany, Italy, Sweden, Switzerland, and Turkey

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Device Reliability and Effect of Temperature on Memristors: Nanostructured V₂O₅;IEEE Transactions on Device and Materials Reliability;2024-06

2. Cycle-Accurate FPGA Emulation of RRAM Crossbar Array: Efficient Device and Variability Modeling with Energy Consumption Assessment;2024 IEEE 25th Latin American Test Symposium (LATS);2024-04-09

3. A Fully Automated Platform for Evaluating ReRAM Crossbars;2024 IEEE 25th Latin American Test Symposium (LATS);2024-04-09

4. Fully Binarized Graph Convolutional Network Accelerator Based on In‐Memory Computing with Resistive Random‐Access Memory;Advanced Intelligent Systems;2024-03-25

5. A Current Mirror Based Read Circuit Design with Multi-Level Capability for Resistive Switching Devices;2024 International Conference on Electronics, Information, and Communication (ICEIC);2024-01-28

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