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Analytical Multistage Thermal Model for FEOL Reliability Considering Self-and Mutual-Heating

  • Published:2018-09 Issue:9 Volume:65 Page:3633-3639
  • ISSN:0018-9383
  • Container-title:IEEE Transactions on Electron Devices
  • language:
  • Short-container-title:IEEE Trans. Electron Devices

Author:

Chen Wangyong,Cai Linlin,Zhao Kai,Zhang Xing,Liu Xiaoyan,Du Gang

Funder

National High-Tech Research and Development Program

National Natural Science Foundation of China

Natural Science Foundation of Beijing Municipality

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrothermal Small-Signal Model of Nanosheet FETs With Zero-Temperature-Coefficient Based Parameters Extraction Method;IEEE Transactions on Electron Devices;2024-07

2. A Neural Network-based Framework for Accelerated Device-Circuit Electrothermal Co-Simulations in GAAFETs;2024 2nd International Symposium of Electronics Design Automation (ISEDA);2024-05-10

3. Self-Heating Effect of Device-Circuit with Back-side Power Delivery Network beyond 3nm Node;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14

4. Investigation of Self-Heating Effect on Forksheet Field-Effect Transistors;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17

5. The heat dissipation path of self-heating effects for the SOI MOSFET by considering the BOX layer and the TiN barrier layer;Journal of Physics D: Applied Physics;2024-02-01
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