Thermal Mitigation and Optimization Via Multitier Bond Wire Layout for IGBT Modules Considering Multicellular Electro-Thermal Effect
Author:
Affiliation:
1. College of Electrical Engineering, Zhejiang University, Hangzhou, China
2. Department of Power Module, Hangzhou Silan Microelectronics Company Limited, Hangzhou, China
Funder
National Science Foundation for Distinguished Young Scholars of China
National Natural Science Foundation of China
National Science Foundation for Young Scholars of China
Natural Science Foundation of Zhejiang Province
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/9714885/09672685.pdf?arnumber=9672685
Reference34 articles.
1. Self inductance formulas for multi-turn rectangular loops used with vehicle detectors
2. Analytical Models for Calculating the Inductances of Bond Wires in Dependence on their Shapes, Bonding Parameters, and Materials
3. IR Camera Validation of IGBT Junction Temperature Measurement via Peak Gate Current
4. Degradation Assessment in IGBT Modules Using Four-Point Probing Approach
5. Multiple Slope Switching Waveform Approximation to Improve Conducted EMI Spectral Analysis of Power Converters
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