Sub-millimeter wave InP technologies and integration techniques

Author:

Radisic Vesna,Leong Kevin M. K. H.,Scott Dennis W.,Monier Cedric,Mei X. B.,Deal William R.,Gutierrez-Aitken Augusto

Publisher

IEEE

Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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2. Semiconductor Solutions for 5G;Advanced Materials and Components for 5G and Beyond;2022

3. Semiconductor technologies for 5G implementation at millimeter wave frequencies – Design challenges and current state of work;Engineering Science and Technology, an International Journal;2021-02

4. A Link-Layer Synchronization and Medium Access Control Protocol for Terahertz-Band Communication Networks;IEEE Transactions on Mobile Computing;2021-01-01

5. Routing Protocol Design for Directional and Buffer-limited Terahertz Communication Networks;ICC 2020 - 2020 IEEE International Conference on Communications (ICC);2020-06

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