Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks-Reference-Cited by-同舟云学术

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Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks

Published:2020-10-21 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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Author:

Schmidt Konstantin,Thielen Nils,Voigt Christian,Seidel Reinhardt,Franke Jorg,Milde Yannik,Bonig Jochen,Beitinger Gunter

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9292129/9292133/09292292.pdf?arnumber=9292292

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Robust vision detection of pipeline solder joints;Soldering & Surface Mount Technology;2024-07-03

2. Image defect classification of surface mount technology welding based on the improved ResNet model;Journal of Engineering Research;2024-06

3. Advancements in PCB Components Recognition Using WaferCaps: A Data Fusion and Deep Learning Approach;Electronics;2024-05-10

4. X-Factor: Deep Learning-based PCB Counterfeit Detection using X-Ray CT Techniques for Hardware Assurance;Proceedings of the 21st ACM International Conference on Computing Frontiers: Workshops and Special Sessions;2024-05-07

5. Optimizing Machine Learning Performance via Dataset Generation for X-ray Image Classification;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

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