Enhancing adhesion between mold compound and substrate in BGA packaging-Reference-Cited by-同舟云学术

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Enhancing adhesion between mold compound and substrate in BGA packaging

Published: Issue: Volume: Page:
ISSN:
Container-title:1997 Proceedings 47th Electronic Components and Technology Conference
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Author:

Cui C.Q.,Lim T.B.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx3/4801/13278/00606221.pdf?arnumber=606221

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhancing the Interface Adhesion and Reliability Study of High T_g EMC and Substrate for Multichip Package;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Underfill Selection Against Moisture in Flip Chip BGA Packages;Moisture Sensitivity of Plastic Packages of IC Devices;2010

3. Polymer surface with graft chains;Progress in Polymer Science;2003-02

4. Enhancement of underfill encapsulants for flip‐chip technology;Soldering & Surface Mount Technology;1999-12

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