A new Ni-W thin film metallization for solder interconnections and design method of metallization thickness-Reference-Cited by-同舟云学术

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A new Ni-W thin film metallization for solder interconnections and design method of metallization thickness

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Container-title:1997 Proceedings 47th Electronic Components and Technology Conference
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Author:

Harada M.,Satoh R.,Yamada O.,Yabushita A.,Itoh M.,Netsu T.,Terouchi T.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx3/4801/13278/00606271.pdf?arnumber=606271

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of the thickness of Au layer in Au/Ni-Co/W metallization stack on the microstructures and wetting quality of Sn-Pb alloy solder;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

2. Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball;Key Engineering Materials;2011-01

3. Reactions of lead-free solders with CuNi metallizations;Journal of Electronic Materials;2000-10

4. Development of under bump metallizations for flip chip bonding to organic substrates;Journal of Electronic Materials;1999-11

5. Under bump metallizations for lead free solders;2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

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