A piezoresistive sensor chip for measurement of stress in electronic packaging-Reference-Cited by-同舟云学术

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A piezoresistive sensor chip for measurement of stress in electronic packaging

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Container-title:Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)
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Author:

Jaeger R.C.,Suhling J.C.,Carey M.T.,Johnson R.W.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx2/1029/8043/00346775.pdf?arnumber=346775

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Stress-Dependent MOSFET Model for Use in Circuit Simulations;2023 46th MIPRO ICT and Electronics Convention (MIPRO);2023-05-22

2. Dynamic Stress Measurements of Electronic Devices during Active Operation;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05

3. Characterization of Moisture Induced Die Stresses in Flip Chip Packaging;2016 IEEE 66th Electronic Components and Technology Conference (ECTC);2016-05

4. Thermo-mechanical characterization of passive stress sensors in Si interposer;Microelectronics Reliability;2015-04

5. Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping;Journal of Electronic Packaging;2012-07-18

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