A non-destructive inspection method for electronic packaging reliability incorporating mechanical and thermal information
Author:
Affiliation:
1. School of Mechanical Science and Engineering, Huazhong University of Science and Technology,Wuhan,Hubei Province,China,430074
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013236.pdf?arnumber=10013236
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