Solder Joint Inspection on Printed Circuit Boards: A Survey and a Dataset
Author:
Affiliation:
1. Department of Electrical and Electronics Engineering, Hacettepe University, Ankara, Turkey
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Instrumentation
Link
http://xplorestaging.ieee.org/ielx7/19/10012124/10129988.pdf?arnumber=10129988
Reference128 articles.
1. Anomaly Detection for Solder Joints Using β-VAE
2. Feature-extraction-based inspection algorithm for IC solder joints;wu;IEEE Trans Compon Packag Manuf Technol,2011
3. A tiered-color illumination approach for machine inspection of solder joints
4. Soldering defect detection in automatic optical inspection
5. Classification of Solder Joint Using Feature Selection Based on Bayes and Support Vector Machine
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