Compute-in-Memory Chips for Deep Learning: Recent Trends and Prospects-Reference-Cited by-同舟云学术

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Compute-in-Memory Chips for Deep Learning: Recent Trends and Prospects

Published:2021 Issue:3 Volume:21 Page:31-56
ISSN:1531-636X
Container-title:IEEE Circuits and Systems Magazine
language:
Short-container-title:IEEE Circuits Syst. Mag.

Author:

Yu Shimeng^ORCID,Jiang Hongwu,Huang Shanshi,Peng Xiaochen,Lu Anni

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Science Applications

Link

http://xplorestaging.ieee.org/ielx7/7384/9512839/09512855.pdf?arnumber=9512855

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2. Capacitance and Conductance Compensation Methods for Efficient Computing‐In‐Memory Designs;Advanced Electronic Materials;2024-09-06

3. veriSIMPLER: An Automated Formal Verification Methodology for SIMPLER MAGIC Design Style Based In-Memory Computing;IEEE Transactions on Circuits and Systems I: Regular Papers;2024-09

4. Thermally Constrained Codesign of Heterogeneous 3-D Integration of Compute-in-Memory, Digital ML Accelerator, and RISC-V Cores for Mixed ML and Non-ML Workloads;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2024-09

5. Endurance-Aware Compiler for 3-D Stackable FeRAM as Global Buffer in TPU-Like Architecture;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2024-09

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