Thermal Image Analysis of Conductive Joints of Flexible Printed Circuit (FPC) using Anisotropic Conductive Films (ACF) Bonding
Author:
Affiliation:
1. National Chiayi University,No.300 Syuefu Rd.,Department of Mechanical and Energy Engineering,Chiayi,Taiwan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10179490/10179492/10179585.pdf?arnumber=10179585
Reference5 articles.
1. Electrical resistance effects of anisotropic conductive film-assembled flex-on-flex packages under static bending loads
2. Investigating the Deformation, Breakage and Number on Conductive Particle of Flim-on-Glass Packaging Using Anisotropic Conductive Film Bonding
3. Investigation on fracture and conductivity of flex-on-film flexible bonding using anisotropic conductive film considering repeated bending
4. A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages
5. Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications
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