Thermal and Mechanical Lid Design for a Multi-Chip Modular Flip-Chip Package
Author:
Affiliation:
1. Intel Corporation,Client Physicals Architecture,Bangalore,India
2. Intel Corporation,Technology Enablement,Munich,Germany
3. Intel Corporation,Client System Architecture,Penang,Malaysia
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899580.pdf?arnumber=9899580
Reference7 articles.
1. Block-Based Finite Element Modeling, Simulation, and Optimization of the Warpage of Embedded Trace Substrate
2. The Correlation of Package Coplanarity and Reflow Warpage to SMT;yung hsiang;34th International Electronic Manufacturing Technology Conference,2010
3. Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks
4. A Comparative Study on Reduced System Thermal Models for Transient Simulations
5. Lidless and lidded Flip Chip Packages for Advanced Applications
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