High Strain Rate Materials Characterization at Low Test Temperatures for Thermally Aged SAC-Q Solder Alloys
Author:
Affiliation:
1. Auburn University,NSF-CAVE3 Electronics Research Center,Department of Mechanical Engineering,Auburn,AL,36849
2. US Army CCDC-AvMC,Huntsville,AL,35898
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899535.pdf?arnumber=9899535
Reference34 articles.
1. Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact;tee;2004 Proceedings 54th Electronic Components and Technology Conference (IEEE Cat No 04CH37546),2004
2. Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging
3. Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling
4. Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
5. A Methodology for Drop Performance Modeling and Application for Design Optimization of Chip-Scale Packages
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