Investigation of Low-Profile, High-Performance 62-mm SiC Power Module Package
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Energy Engineering and Power Technology
Link
http://xplorestaging.ieee.org/ielx7/6245517/9502054/08981944.pdf?arnumber=8981944
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Innovative Reverse Current Coupling Layout of SiC Power Module for Parasitic Inductance Reduction;IEEE Transactions on Electron Devices;2024-09
2. A Comprehensive Design Method for Multichip Double-Sided Cooling Power Module With Multidimensional Self-and Mutual Inductances;IEEE Transactions on Power Electronics;2024-08
3. Design of protection resistor for a certain type of integrated power operational amplifier based on TRIZ theory;Fourth International Conference on Mechanical Engineering, Intelligent Manufacturing, and Automation Technology (MEMAT 2023);2024-04-01
4. Parallel Connection of Silicon Carbide MOSFETs—Challenges, Mechanism, and Solutions;IEEE Transactions on Power Electronics;2023-08
5. Hybrid Si/SiC Switches: A Review of Control Objectives, Gate Driving Approaches and Packaging Solutions;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-04
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