Use Artificial Neural Network to fit stress-strain curve of Chaboche model on lead-free solder SAC305-Reference-Cited by-同舟云学术

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Use Artificial Neural Network to fit stress-strain curve of Chaboche model on lead-free solder SAC305

Published:2023-10-25 Issue: Volume: Page:
ISSN:
Container-title:2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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Author:

Lee C.E.¹,Yuan Cadmus²,Chiang K.N.³

Affiliation:

1. Advanced Microsystem Packaging and Nano-Mechanics Research Lab,Taiwan

2. Feng Chia University,Department of Mechanical and Computer-aided Engineering,Taichung,Taiwan,R.O.C

3. National Tsing Hua University,Department of Power Mechanical Engineering,Hsinchu 300,Taiwan,R.O.C

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10348606/10348630/10348841.pdf?arnumber=10348841

Reference17 articles.

1. Enhancing the Reliability of Wafer Level Packaging by Using Solder Joints Layout Design

2. An Effective Approach for Three-Dimensional Finite Element Analysis of Ball Grid Array Typed Packages

3. Reliability assessment using modified energy based model for WLCSP solder joints

4. On some modifications of kinematic hardening to improve the description of ratchetting effects

5. Constitutive equations for cyclic plasticity and cyclic viscoplasticity

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