Quantifying TD Interest: Are we Getting Closer, or Not Even That?-Reference-Cited by-同舟云学术

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Quantifying TD Interest: Are we Getting Closer, or Not Even That?

Published:2022-08 Issue: Volume: Page:
ISSN:
Container-title:2022 48th Euromicro Conference on Software Engineering and Advanced Applications (SEAA)
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Author:

Arvanitou Elvira-Maria¹,Argyriadou Pigi¹,Koutsou Georgia¹,Ampatzoglou Apostolos¹,Chatzigeorgiou Alexander¹

Affiliation:

1. University of Macedonia,Department of Applied Informatics,Thessaloniki,Greece

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10011188/10011189/10011500.pdf?arnumber=10011500

Reference33 articles.

1. Tracking technical debt — An exploratory case study

2. Towards an open-source tool for measuring and visualizing the interest of technical debt

3. In Search of a Metric for Managing Architectural Technical Debt

4. Identification and management of technical debt: A systematic mapping study

5. A semi-automated framework for the identification and estimation of Architectural Technical Debt: A comparative case-study on the modularization of a software component

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Business-driven technical debt management using Continuous Debt Valuation Approach (CoDVA);Information and Software Technology;2023-12

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