Prediction of Thermally Accelerated Aging Process at 28nm
Author:
Affiliation:
1. University of British Columbia,Dept. of ECE,Vancouver,Canada
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9810327/9810358/09810415.pdf?arnumber=9810415
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1. Self-heating thermal-aware testing of FPGAs
2. Fast chip aging prediction by product-like VMIN drift characterization on test structures
3. Circuit Techniques for BTI and EM Accelerated and Active Recovery
4. Compact Modeling of MOSFET Wearout Mechanisms for Circuit-Reliability Simulation
5. NBTI and HCI Aging Prediction and Reliability Screening During Production Test
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